LMD Bussing Module | Size 20 Contacts, 2 Bussing Circuits

AMPHENOL

Call For Pricing

Available to order

EDMO # LMD-6002-P

MFR Part # LMD-6002-P-ND

Need help placing an order? Call 800-235-3300 or Contact us

Product Description

The LMD Bussing Modules were designed to provide a complete terminal junction system. This module conveniently and simply allows for a plurality of circuit network configurations, eliminated the need for “pigtails”, termination strips or termination hardware. Nine bussing configurations are currently available in either a standard or sealed module. Sealed modules have a rubber interfacial seal for increased environmental resistance. LMD Bussing Modules are currently available in black thermoplastic material.

This LMD Bussing Module (EDMO# LMD-6002-P) is a standard module with size 20 contacts and 2 bussing circuits.

Features

Comprised of a housing, modules and contacts—each ordered separately, requiring assembly
Lightweight housings are offered in three materials: standard black thermoplastic, high performance composite material for EMI shielding, white thermoplastic nylon material with increased solvent resistance
Four standard modules are available with the following contact arrangements: 1 #8, 4 #16, 9 #20, 16 #22
Modules are available in sealed and unsealed versions
Linear module design may be used for rack and panel or cable to cable applications
Bussing modules available to allow for a plurality of circuit network configurations without extra hardware
Diode modules provide a current protection system for avionic instrumentation packages and eliminate the need for dedicated PC boards and other hardware
Miniature relay modules can be added which eliminate the need for printed circuit boards and hardware

Specifications

Dimensions:

0.500 x 0.450 in (12.70 x 11.43 mm)
Contact Size:

20
Bussing Circuits:

2
A. Ref.:

1.326
Temperature Rating:

-55°C to 140ºC (-67°F to 284°F)
Insulation Resistance:

5000 MΩ (Initial); 1000 MΩ (After 96 hours humidity)
Durability:

250 cycles
Vibration:

Maximum discontinuity of one microsecond when subjected to sinusoidal vibration of 10 to 2000 Hz at 15 gravity units
Physical Shock:

Maximum discontinuity of one microsecond when subjected to 1/2 -sine-wave transient shock of 50 gravity units with pulse duration of 11 milliseconds
Module Insertion & Removal Force:

5 lbs (Max)
Module Retention:

70 lbs (Min)